Photosensitive element driving mechanism

ABSTRACT

A photosensitive element driving mechanism is provided and includes a fixed assembly, a first movable assembly, a photosensitive element and a first driving assembly. The fixed assembly has a base plate. The first movable assembly includes a circuit member movable relative to the fixed assembly, and the circuit member includes a circuit member body and a movable cantilever. The photosensitive element is configured to receive light traveling along an optical axis. The photosensitive element is disposed on the circuit member body and is electrically connected to the circuit member. The first driving assembly is configured to drive the first movable assembly to move relative to the fixed assembly. There is a gap between the first movable assembly and the fixed assembly, and only the photosensitive element is disposed on the circuit member body.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.62/703,147, filed Jul. 25, 2018, and China Patent Application No.201910609987.X, filed Jul. 8, 2019, the entirety of which areincorporated by reference herein.

BACKGROUND OF THE DISCLOSURE Field of the Disclosure

The present disclosure relates to a driving mechanism, and in particularit relates to a photosensitive element driving mechanism for driving aphotosensitive element.

Description of the Related Art

As technology has progressed, many kinds of electronic devices such astablet computers and smartphones have begun to include the functionalityof digital photography or video recording. A user can operate theelectronic device to capture various images with an photosensitiveelement driving mechanism (such as a camera module) that is included inthe electronic device, and therefore electronic devices equipped withcamera modules have gradually become popular.

Today's design of electronic devices continues to move toward the trendof miniaturization so that the various components of the camera moduleor its structure must also be continuously reduced, so as to achieve thepurpose of miniaturization. In general, a driving mechanism of thecamera module has a camera lens holder configured to hold a camera lens,and the driving mechanism can have the functions of auto focusing oroptical image stabilization. However, although the existing drivingmechanism can achieve the aforementioned functions of photographing orvideo recording, they still cannot meet all the needs ofminiaturization.

Therefore, how to design a camera module that can make the image cleareris a topic nowadays that needs to be discussed and solved.

BRIEF SUMMARY OF THE DISCLOSURE

Accordingly, one objective of the present disclosure is to provide aphotosensitive element driving mechanism to solve the above problems.

According to some embodiments, a photosensitive element drivingmechanism is provided and includes a fixed assembly, a first movableassembly, a photosensitive element and a first driving assembly. Thefixed assembly has a base plate. The first movable assembly includes acircuit member movable relative to the fixed assembly, and the circuitmember includes a circuit member body and a movable cantilever. Thephotosensitive element is configured to receive light traveling along anoptical axis. The photosensitive element is disposed on the circuitmember body and is electrically connected to the circuit member. Thefirst driving assembly is configured to drive the first movable assemblyto move relative to the fixed assembly. There is a gap between the firstmovable assembly and the fixed assembly, and only the photosensitiveelement is disposed on the circuit member body.

According to some embodiments, the movable cantilever has a firstsegment extending in a direction different from the optical axis, thefirst segment is electrically connected to the photosensitive elementand the fixed assembly, and the first movable assembly moves relative tothe fixed assembly through the movable cantilever.

According to some embodiments, the first segment has a first circuitlayer and a second circuit layer, and the first circuit layer and thesecond circuit layer are distributed on different planes.

According to some embodiments, a size of the first segment in adirection of the optical axis is greater than a size of the firstsegment in a direction perpendicular to the optical axis.

According to some embodiments, the first movable assembly furtherincludes a first frame configured to accommodate the photosensitiveelement, and the first frame has a recessed portion corresponding to thefirst segment.

According to some embodiments, the movable cantilever further has asecond segment, and the second segment and the first segment extend indifferent directions.

According to some embodiments, when the first driving assembly drivesthe circuit member body to move in a first moving direction, an amountof deformation of the first segment is greater than an amount ofdeformation of the second segment.

According to some embodiments, when the first driving assembly drivesthe circuit member body to move in a second moving direction, the amountof deformation of the first segment is smaller than the amount ofdeformation of the second segment, and the first moving direction is notparallel to the second moving direction.

According to some embodiments, the circuit member body is made of arigid material, and the movable cantilever is made of a flexiblematerial.

According to some embodiments, the circuit member body and the movablecantilever are integrally formed in one piece and are made of a flexiblematerial, and the photosensitive element driving mechanism furtherincludes a plate body connected to a bottom of the circuit member body.

According to some embodiments, the plate body is a metal plate,configured to promote the heat dissipation of the circuit member by heatconduction.

According to some embodiments, the photosensitive element drivingmechanism further includes a second movable assembly and a seconddriving assembly. The second movable assembly is configured to hold anoptical component, wherein the second movable assembly is movablerelative to the fixed assembly. The second driving assembly isconfigured to drive the second movable assembly to move in a firstdirection relative to the fixed assembly, wherein both the first drivingassembly and the second driving assembly are electrically connected tothe circuit member.

According to some embodiments, the fixed assembly further includes anouter frame configured to accommodate the first movable assembly, thesecond movable assembly and the photosensitive element, and thephotosensitive element driving mechanism further includes a controlcircuit disposed in the outer frame and adjacent to the second movableassembly.

According to some embodiments, the fixed assembly further includes anouter frame configured to accommodate the first movable assembly, thesecond movable assembly and the photosensitive element, and thephotosensitive element driving mechanism further includes a controlcircuit disposed outside the outer frame and disposed on the base plate.

According to some embodiments, the outer frame is disposed on the baseplate.

According to some embodiments, the photosensitive element drivingmechanism further includes a third driving assembly configured to drivethe second movable assembly to move in a second direction relative tothe fixed assembly, the second direction is not parallel to the firstdirection, and the third driving assembly is electrically connected tothe circuit member.

According to some embodiments, the second driving assembly includes aplurality of second driving magnetic components, and when viewed in adirection of the optical axis, the second driving magnetic componentsare arranged in a rotationally symmetrical form with respect to theoptical axis.

According to some embodiments, the photosensitive element drivingmechanism further includes a position sensing assembly configured tosense motion of the first movable assembly relative to the fixedassembly.

According to some embodiments, the photosensitive element is disposedbetween the circuit member and the first driving assembly.

According to some embodiments, the first driving assembly includes aspring sheet, an insulating layer is formed on the spring sheet, and thefirst driving assembly further includes at least one electronic lineformed on the insulating layer.

The present disclosure provides a photosensitive element drivingmechanism which has a first driving assembly and a first movableassembly. The first movable assembly is held by the first drivingassembly and is suspended in the outer frame of the fixed assembly. Thephotosensitive element is disposed on the circuit member of the firstmovable assembly, and the first driving assembly is configured to drivethe circuit member and the photosensitive element to move relative tothe fixed assembly, so as to achieve the purpose of optical imagestabilization.

Furthermore, in some embodiments, the photosensitive element drivingmechanism may further include a third driving assembly configured todrive the holder of the second movable assembly and the opticalcomponent to move along the XY plane relative to the fixed assembly, soas to further enhance the effect of optical image stabilization.

Additional features and advantages of the disclosure will be set forthin the description which follows, and, in part, will be obvious from thedescription, or can be learned by practice of the principles disclosedherein. The features and advantages of the disclosure can be realizedand obtained by means of the instruments and combinations pointed out inthe appended claims. These and other features of the disclosure willbecome more fully apparent from the following description and appendedclaims, or can be learned by the practice of the principles set forthherein.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 shows a schematic diagram of a photosensitive element drivingmechanism 100 according to an embodiment of the present disclosure.

FIG. 2 shows an exploded diagram of the photosensitive element drivingmechanism 100 according to the embodiment of the present disclosure.

FIG. 3 shows a cross-sectional view along line A-A′ in FIG. 1 accordingto the embodiment of the present disclosure.

FIG. 3A shows a cross-sectional view along line A-A′ in FIG. 1 accordingto an embodiment of the present disclosure.

FIG. 4 is an exploded diagram of the first movable assembly 20 accordingto an embodiment of the present disclosure.

FIG. 5 is a schematic structural diagram of the first movable assembly20 according to an embodiment of the present disclosure.

FIG. 6 is a schematic diagram of the first driving assembly 30 accordingto an embodiment of the present disclosure.

FIG. 7 is a top view of the circuit member 114 and the magnetic elementsMG according to an embodiment of the present disclosure.

FIG. 8 is a schematic diagram of a photosensitive element drivingmechanism 200 according to another embodiment of the present disclosure.

FIG. 9 is a partial exploded diagram of the photosensitive elementdriving mechanism 200 according to another embodiment of the presentdisclosure.

FIG. 10 is a cross-sectional view of the photosensitive element drivingmechanism 200 according to another embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE ILLUSTRATIVE EMBODIMENTS

In the following detailed description, for the purposes of explanation,numerous specific details and embodiments are set forth in order toprovide a thorough understanding of the present disclosure. The specificelements and configurations described in the following detaileddescription are set forth in order to clearly describe the presentdisclosure. It will be apparent, however, that the exemplary embodimentsset forth herein are used merely for the purpose of illustration, andthe inventive concept can be embodied in various forms without beinglimited to those exemplary embodiments. In addition, the drawings ofdifferent embodiments can use like and/or corresponding numerals todenote like and/or corresponding elements in order to clearly describethe present disclosure. However, the use of like and/or correspondingnumerals in the drawings of different embodiments does not suggest anycorrelation between different embodiments. The directional terms, suchas “up”, “down”, “left”, “right”, “front” or “rear”, are referencedirections for accompanying drawings. Therefore, using the directionalterms is for description instead of limiting the disclosure.

In this specification, relative expressions are used. For example,“lower”, “bottom”, “higher” or “top” are used to describe the positionof one element relative to another. It should be appreciated that if adevice is flipped upside down, an element at a “lower” side will becomean element at a “higher” side.

The terms “first”, “second”, “third”, “fourth”, and the like are merelygeneric identifiers and, as such, may be interchanged in variousembodiments. For example, while an element may be referred to as a“first” element in some embodiments, the element may be referred to as a“second” element in other embodiments.

The terms “about” and “substantially” typically mean +/−20% of thestated value, more typically +/−10% of the stated value and even moretypically +/−5% of the stated value. The stated value of the presentdisclosure is an approximate value. When there is no specificdescription, the stated value includes the meaning of “about” or“substantially”.

Please refer to FIG. 1 to FIG. 3 . FIG. 1 shows a schematic diagram ofan photosensitive element driving mechanism 100 according to anembodiment of the present disclosure, FIG. 2 shows an exploded diagramof the photosensitive element driving mechanism 100 according to theembodiment of the present disclosure, and FIG. 3 shows a cross-sectionalview along line A-A′ in FIG. 1 according to the embodiment of thepresent disclosure. The photosensitive element driving mechanism 100 canbe an optical camera system and can be configured to hold and drive anoptical component (not shown in the figures). The photosensitive elementdriving mechanism 100 can be installed in different electronic devicesor portable electronic devices, such as a smartphone or a tabletcomputer, for allowing a user to perform the image capturing function.In this embodiment, the photosensitive element driving mechanism 100 canbe a voice coil motor (VCM) with an auto-focusing (AF) function, but itis not limited thereto. In other embodiments, the photosensitive elementdriving mechanism 100 can also perform the functions of auto-focusingand optical image stabilization (OIS).

As shown in FIG. 1 to FIG. 3 , in the embodiment, the photosensitiveelement driving mechanism 100 mainly includes a fixed assembly 10, afirst movable assembly 20, a first driving assembly 30, and a secondmovable assembly 40, a second driving assembly 50 and a control circuitCT. The first driving assembly 30 is configured to drive the firstmovable assembly 20 to move relative to the fixed assembly 10, and thesecond driving assembly 50 is configured to drive the second movableassembly 40 to move relative to the fixed assembly 10. The controlcircuit CT is configured to control operation of the first drivingassembly 30 and the second driving assembly 50.

In this embodiment, the fixed assembly 10 can include an outer frame102, a base 112, and a base plate 120. The second movable assembly 40can include a first elastic member 106, a holder 108, and a secondelastic member 110. The second driving assembly 50 can include aplurality of magnetic elements MG (the second magnetic drivingelements), and a driving coil DCL.

As shown in FIG. 2 , the outer frame 102 has a hollow structure, and anouter frame opening 1021 is formed on the outer frame 102. A baseopening 1121 is formed on the base 112. The center of the outer frameopening 1021 corresponds to an optical axis O of optical component (notshown) which is held by the holder 108. The base opening 1121corresponds to an image sensing element (the photosensitive element 122)disposed below the base 112. External light can enter the outer frame102 through the outer frame opening 1021, and then to be received by thephotosensitive element 122 after traveling through the optical componentand the base opening 1121, so as to generate a digital image signal.

Furthermore, the outer frame 102 can have an accommodating space 1023configured to accommodate the first movable assembly 20, the firstdriving assembly 30, the second movable assembly 40, and the seconddriving assembly 50. It should be noted that the outer frame 102 isfixedly disposed on the base plate 120, and the control circuit CT isdisposed outside the outer frame 102 and disposed on the base plate 120,but it is not limited thereto. In other embodiments, the control circuitCT can be disposed in the accommodating space 1023 of the outer frame102.

In this embodiment, the second driving assembly 50 includes fourmagnetic elements MG, and the shape of the magnetic elements MG may be along strip-shaped structure, but the number and shape of the magneticelements MG are not limited thereto. Furthermore, the magnetic elementMG can be a multi-pole magnet.

As shown in FIG. 2 and FIG. 3 , the magnetic elements MG are fixedlydisposed on the inner wall surface of the outer frame 102. In thisembodiment, the driving coil DCL may be a winding coil and may bedisposed around the holder 108, and the driving coil DCL corresponds tothe plurality of magnetic elements MG. When the driving coil DCL isprovided with electricity, the driving coil DCL acts with the pluralityof magnetic elements MG generate to an electromagnetic force to drivethe holder 108 and the optical component to move in a first directionrelative to the base 112, such as along the direction of the opticalaxis O (the Z-axis).

In this embodiment, the first elastic member 106 is disposed on themagnetic elements MG, the outer portion of the first elastic member 106is fixed to the magnetic elements MG (or the outer frame 102), and theouter portion of the second elastic member 110 is fixed to corners ofthe base 112. In addition, the inner portions of the first elasticmember 106 and the second elastic member 110 are respectively connectedto the upper side and the lower side of the holder 108, so that theholder 108 can be suspended in the outer frame 102 (as shown in FIG. 3). Accordingly, the second driving assembly 50 can drive the holder 108to move relative to the fixed assembly 10.

As shown in FIG. 3 , the first driving assembly 30 is disposed betweenthe first movable assembly 20 and the second movable assembly 40. Whenviewed in the direction of the optical axis O, the first drivingassembly 30 partially overlaps the first movable assembly 20.Furthermore, the outer frame 102 has a first top surface S1, a secondtop surface S2 and a side wall 1025. The first top surface S1 faces thefirst movable assembly 20, and the base 112 is fixed to the first topsurface S1. In addition, the first driving assembly 30 is disposedbetween the base 112 and the first movable assembly 20, and when viewedin the direction of the optical axis O, the base 112 partially overlapsthe first top surface S1.

As shown in FIG. 3 , the distance between the second top surface S2 andthe first movable assembly 20 is greater than the distance between thefirst top surface S1 and the first movable assembly 20 (in the directionof the optical axis O). The side wall 1025 is parallel to the opticalaxis O, and when viewed in the direction of the optical axis O, thecircuit member 114 partially overlaps the side wall 1025.

In this embodiment, the first movable assembly 20 can include a filterFL, a first frame 118, a photosensitive element 122, and a circuitmember 114. The filter FL is disposed on the first frame 118 andconfigured to filter the light received by the photosensitive element122. The circuit member 114 includes a circuit member body 1141, and thephotosensitive element 122 is disposed between the circuit member 114and the first driving assembly 30. Specifically, the photosensitiveelement 122 is disposed on the circuit member body 1141 and iselectrically connected to the circuit member body 1141.

Furthermore, the first frame 118 is configured to accommodate thephotosensitive element 122, and the first frame 118 can protect thecircuit member body 1141 and the photosensitive element 122 so as toprevent the photosensitive element 122 from being damaged due tocollisions with other components when the first movable assembly 20moves.

Please refer to FIG. 2 to FIG. 4 together. FIG. 4 is an exploded diagramof the first movable assembly 20 according to an embodiment of thepresent disclosure. In this embodiment, the circuit member 114 caninclude a plurality of movable cantilevers 1143. For example, thecircuit member 114 in FIG. 4 includes two movable cantilevers 1143connected to the circuit member body 1141 and disposed on two sides ofthe circuit member body 1141. By providing two movable cantilevers 1143on two sides of the circuit member body 1141, the overall structure ofthe first movable assembly 20 can be symmetrical and easier to achievebalance.

As shown in FIG. 4 , each movable cantilever 1143 can have a firstsegment SG1, a second segment SG2, and a connecting portion SG3. Thefirst segment SG1 and the second segment SG2 extend along directionsdifferent from the optical axis O (for example, along the X-axis or theY-axis), and the second segment SG2 and the first segment SG1 extend indifferent directions.

One end of the first segment SG1 is connected to the circuit member body1141, and the other end of the first segment SG1 is connected to thesecond segment SG2. The second segment SG2 is connected between theconnecting portion SG3 and the first segment SG1, and the connectingportion SG3 is fixedly connected to the base plate 120 so that thecircuit member body 1141 of the first movable assembly 20 can moverelative to the fixed assembly 10 by the movable cantilever 1143.

Furthermore, the circuit member 114 may have a first surface 114Scontinuously distributed over the circuit member body 1141, the firstsegment SG1, the second segment SG2, and the connecting portion SG3. Thefirst surface 114S on the circuit member body 1141 faces thephotosensitive element 122, and the first surface 114S on the firstsegment SG1 or that on the second segment SG2 is parallel to the opticalaxis O.

As shown in FIG. 4 , the size (a width W1) of the first segment SG1 inthe direction of the optical axis O is greater than the size (athickness T1) of the first segment SG1 in a direction (the Y-axis)perpendicular to the optical axis O. Based on such a structural design,a portion of the circuit member 114 can be elastic so as to facilitatemovement of the circuit member body 1141 in a direction perpendicular tothe optical axis O.

When the first driving assembly 30 drives the circuit member body 1141to move in a first moving direction (for example, the Y-axis), theamount of deformation of the first segment SG1 is greater than theamount of deformation of the second segment SG2. When the first drivingassembly 30 drives the circuit member body 1141 to move in a secondmoving direction (for example, the X-axis), the amount of deformation ofthe first segment SG1 is smaller than the amount of deformation of thesecond segment SG2, and the first moving direction is not parallel tothe second moving direction.

In this embodiment, the circuit member 114 can be a flexible printedcircuit (FPC) board, thereby improving the mechanical strength of thecircuit member 114 and simplifying the manufacturing process.Furthermore, based on the design of the first segment SG1 and the secondsegment SG2, the local plasticity of the circuit member 114 can beincreased, and the reliability of the circuit member 114 can be furtherimproved.

In some embodiments, the circuit member body 1141 and the movablecantilevers 1143 are integrally formed in one piece and are made of aflexible material, and the photosensitive element driving mechanism 100may further include a plate body 124 (FIG. 3A) connected to the bottomof the circuit member body 1141. The plate body may be a metal plate,which can increase the rigidity of the circuit member body 1141, and themetal plate can promote the heat dissipation of the circuit member 114by heat conduction.

In addition, in some embodiments of the present disclosure, the circuitmember body 1141 may also be made of a rigid material, and the movablecantilevers 1143 are made of a flexible material. Therefore, the purposeof increasing the rigidity of the circuit member body 1141 and theflexibility of the movable cantilevers 1143 can be achieved at the sametime.

As shown in FIG. 4 , a connector CN can be disposed on the bottom of theconnecting portion SG3, the base plate 120 may be a printed circuitboard, and the connector CN is configured to be connected to a connector(not shown in the figure) on the base plate 120. It should be noted thatthe circuit member 114 may have at least a first circuit layer and asecond circuit layer (not shown), and the first circuit layer and thesecond circuit layer are distributed on different planes. For example,the first circuit layer is adjacent to the first surface 114S, and thesecond circuit layer is farther away from the first surface 114S thanthe first circuit layer.

As a result, the photosensitive element 122 and a plurality ofelectronic components 115 on the circuit member body 1141 can beelectrically connected to the movable cantilever 1143, and areelectrically connected to the base plate 120 through wires of the firstcircuit layer and the second circuit layer of the movable cantilever1143.

In addition, in this embodiment, the first driving assembly 30 and thesecond driving assembly 50 can also be electrically connected to thecircuit member 114, and are electrically connected to the base plate 120and the control circuit CT on the base plate 120 through the circuitmember 114.

It should be noted that, in some embodiments, in order to reduce thearea of the base plate 120, the control circuit CT may also be disposedon the circuit member body 1141, and is electrically connected to thebase plate 120 and a controller or a processor of the electronic devicethrough the wires of the first circuit layer and the second circuitlayer of the movable cantilever 1143, so as to achieve the purpose ofminiaturization.

In some embodiments, only the photosensitive element 122 is disposed onthe circuit member body 1141, thereby increasing the area of thephotosensitive element 122 and improving the photographing effect.

In addition, in some embodiments, the control circuit CT can also bedisposed in the outer frame 102 and is adjacent to the second movableassembly 40, so that the area of the photosensitive element 122 can beincreased and the area of the base plate 120 can be reduced at the sametime, so as to further achieve the purpose of miniaturization.

Please continue to refer to FIG. 3 and FIG. 4 , in this embodiment,there is a gap formed between the first movable assembly 20 and thefixed component 10. Specifically, as shown in FIG. 3 , the base plate120 has a bottom surface 1201 perpendicular to the optical axis O andfacing the first movable assembly 20. In addition, a gap G is formedbetween the circuit member body 1141 and the bottom surface 1201 of thebase plate 120. That is, the first movable assembly 20 is held by thefirst driving assembly 30 and is suspended in the outer frame 102, sothat when the first driving assembly 30 drives the circuit member body1141 and the photosensitive element 122 to move along the XY plane, thecircuit member body 1141 does not collide with the base plate 120.

As shown in FIG. 3 , when viewed in a direction perpendicular to theoptical axis O (for example, viewed along the Y-axis), the first segmentSG1 partially overlaps the first movable assembly 20. For example, thefirst segment SG1 partially overlaps the first frame 118. Based on thisstructural design, the purpose of miniaturization can be achieved.

Further, as shown in FIG. 3 , when viewed along the optical axis O, thefirst top surface S1 partially overlaps the first segment SG1. Moreover,two side openings 1025 are formed on the outer frame 102 so that themovable cantilevers 1143 can pass through the side openings 1025 to theoutside of the outer frame 102. When the photosensitive element drivingmechanism 100 is assembled, the side openings 1025 of the outer frame102 can assist the movable cantilevers 1143 to be positioned, therebyimproving the overall structural strength and improving workability atthe same time, making it easy to produce and assemble.

Next, please refer to FIG. 5 , which is a schematic structural diagramof the first movable assembly 20 according to an embodiment of thepresent disclosure. As shown in FIG. 5 , the first frame 118 has arecessed portion 1181 corresponding to the first segment SG1. Based onthe design of the recessed portion 1181, when the circuit member body1141 and the first frame 118 move along the X-axis or the Y-axis, themovable cantilever 1143 does not collide with the first frame 118,thereby preventing damage to the movable cantilever 1143.

Next, please refer to FIG. 6 , which is a schematic diagram of the firstdriving assembly 30 according to an embodiment of the presentdisclosure. In this embodiment, the first driving assembly 30 caninclude a first driving base 31, a second driving base 32, and aplurality of bias wires 33. The second driving base 32 is fixed to thebottom of the base 112 of the fixed assembly 10 (as shown in FIG. 3 ).In this embodiment, the second driving base 32 can be an annularstructure and surround the optical axis O, and the second driving base32 can extend along a plane perpendicular to the optical axis O.

The second driving base 32 is movably and/or rotatably disposed on thefirst driving base 31. In other words, the first driving base 31 ismovable and/or rotatable relative to the second driving base 32. In thisembodiment, the first driving base 31 can be an annular structure andsurround the optical axis O. The first driving base 31 can extend alonga plane perpendicular to the optical axis O. In addition, the firstdriving base 31 can be fixed to the first movable assembly 20. Forexample, in the embodiment, as shown in FIG. 3 , the first driving base31 can be fixed to the first frame 118.

A first end 331 of the bias wire 33 is connected to the first drivingbase 31, and a second end 332 of the bias wire 33 is connected to thesecond driving base 32. The connection of the bias wire 33 and the firstdriving base 31 and the connection of the bias wire 33 and the seconddriving base 32 can have a plurality of different designs, and they arenot limited to the embodiment of the present disclosure.

In the present embodiment, the bias wires 33 may be made of shape memoryalloys (SMA). For example, the material of the bias wires 33 may includetitanium-nickel alloy (TiNi), titanium-palladium alloy (TiPd),titanium-nickel-copper alloy (TiNiCu), titanium-nickel-palladium alloy(TiNiPd), or a combination thereof, but it is not limited thereto.Therefore, when a voltage is supplied to the bias wire 33, the length ofthe bias wire 33 is changed. For example, when the voltage is greater,the temperature of the bias wire 33 is higher, and when the temperatureof the bias wire 33 is higher, the length of the bias wire 33 isshorter.

Because the first end 331 of the bias wire 33 is connected to the firstdriving base 31, and the second end 332 of the bias wire 33 is connectedto the second driving base 32, when the length of the bias wire 33 isshortened, a pulling force is generated by the bias wire 33 to move (orrotate) the first driving base 31 relative to the second driving base32.

Because the photosensitive element 122 is disposed on the circuit memberbody 1141 of the circuit member 114, and the first frame 118 is fixed tothe circuit member body 1141 and the first driving seat 31, thephotosensitive element 122 can move with the first driving base 31.Based on the design of the first driving assembly 30 and the firstmovable assembly 20, the photosensitive element driving mechanism 100can have the functions of optical image stabilization and shakecompensation. Furthermore, because the first driving assembly 30 isimplemented by a shape memory alloy, electromagnetic interference of thephotosensitive element driving mechanism 100 can be reduced.

In addition, in this embodiment, the first driving assembly 30 canfurther include two spring sheets 34. One end of the spring sheet 34 isconnected to the second driving base 32, and the other end of the springsheet 34 can be connected to the first driving base 31. Therefore, whenthe first driving base 31 moves relative to the second driving base 32and the voltage is stopped from being supplied to the bias wire 33, thespring sheet 34 can provide an elastic force to quickly return the firstdriving base 31 to an initial position.

It should be noted that, in some embodiments, the spring sheet 34 canserve as a conductive element. For example, an insulating layer may beformed on the surface of the spring sheet 34, and a plurality ofelectronic lines may be formed on the insulating layer for electricallyconnecting the spring sheet 34 to other components, such as the seconddriving assembly 50.

Next, please refer to FIG. 2 and FIG. 7 . FIG. 7 is a top view of thecircuit member 114 and the magnetic elements MG according to anembodiment of the present disclosure. In this embodiment, thephotosensitive element driving mechanism 100 may further include aposition sensing assembly 130 for sensing the motion of the firstmovable assembly 20 relative to the fixed assembly 10. In particular,the position sensing assembly 130 can have at least three magneticsensors disposed on the circuit member body 1141 of the first movableassembly 10 and corresponding to the magnetic elements MG (the seconddriving magnetic component) of the second driving assembly 50. In thisembodiment, the position sensing assembly 130 includes a magnetic sensor131, a magnetic sensor 132, and a magnetic sensor 133. It should benoted that, as shown in FIG. 7 , the second driving assembly 50 includesfour magnetic elements MG and are arranged in a rotationally symmetricalform with respect to the optical axis O.

These magnetic sensors are configured to sense a change in the magneticfield of the corresponding magnetic elements MG, thereby sensing themotion of the photosensitive element 122 relative to the base 112 andthe base plate 120. That is, the magnetic sensors can sense the movementof the photosensitive element 122 in the X-axis (or in the Y-axis) andthe rotation around the Z-axis. For example, the magnetic sensor 131 andthe magnetic sensor 132 sense the movement of the photosensitive element122 along the Y-axis, and the magnetic sensor 133 senses the movement ofthe photosensitive element 122 along the X-axis.

In addition, the magnetic sensor 131, the magnetic sensor 132, and themagnetic sensor 133 can sense the rotation of the photosensitive element122 around the Z axis, so as to further improve the accuracy of control.

The motion of the photosensitive element 122 relative to the fixedassembly 10 can be accurately sensed by disposing the position sensingassembly 130. In addition, based on the structural configuration of thisembodiment, the purpose of miniaturization can also be achieved.

Please refer to FIG. 8 to FIG. 10 . FIG. 8 is a schematic diagram of aphotosensitive element driving mechanism 200 according to anotherembodiment of the present disclosure, FIG. 9 is a partial explodeddiagram of the photosensitive element driving mechanism 200 according toanother embodiment of the present disclosure, and FIG. 10 is across-sectional view of the photosensitive element driving mechanism 200according to another embodiment of the present disclosure. In thisembodiment, the photosensitive element driving mechanism 200 includes afirst module M1, a second module M2, and the base plate 120. The firstmodule M1 is disposed on the base plate 120, and the second module M2 isdisposed on the first module M1.

As shown in FIG. 10 , the first module M1 includes an outer frame 202,and the outer frame 202 receives the first driving assembly 30, thefirst movable assembly 20, and a connecting member 201. The connectingmember 201 is fixed to a top wall 2021 of the outer frame 202, and thesecond driving base 32 of the first driving assembly 30 is fixed to theouter frame 202 through the connecting member 201. Similar to theprevious embodiments, the first movable assembly 20 is connected to thefirst driving base 31 of the first driving assembly 30 so that the firstdriving assembly 30 can drive the first movable assembly 20 (and thephotosensitive element 122) to move relative to the base plate 120.

As shown in FIG. 9 and FIG. 10 , the second module M2 includes a casing203 fixedly connected to the base 112, and the base 112 is disposed onthe outer frame 202. In addition, the second module M2 further includesthe second movable assembly 40, the second driving assembly 50, and athird driving assembly 60. The second movable assembly 40 includes aframe 204, the holder 108, the first elastic member 106, the secondelastic member 110, and a plurality of magnetic elements MG. Themagnetic elements MG are fixed to the frame 204, and the holder 108 isconfigured to hold an optical component LS.

The outer ring portion of the first elastic member 106 is connected tothe frame 204, and the outer ring portion of the second elastic member110 is connected to the base 112. The inner ring portion of the firstelastic member 106 and the inner ring portion of the second elasticmember 110 is connected to the upper side and the lower side of theholder 108 so that the holder 108 is suspended within the frame 204. Inaddition, the second movable assembly 40 further includes foursuspension wires 116. One end of the suspension wire 116 is connected tothe first elastic member 106, and the other end of the suspension wire116 is connected to the base 112, so that the frame 204 and the holder108 can move along a second direction, for example, along the X-axis orthe Y-axis. It should be noted that the second direction is not parallelto the first direction.

The third driving assembly 60 includes a circuit board 214 and magneticelements MG, and the circuit board 214 has a third driving coil 2141disposed between the first movable assembly 20 and the second movableassembly 40. When viewed in the direction of the optical axis O, thethird driving coil 2141 partially overlaps the first movable assembly20.

The third driving assembly 60 is configured to drive the second movableassembly 40 to move in the second direction relative to the fixedassembly 10. It should be noted that the third driving assembly 60 andthe second driving assembly 50 share the magnetic elements MG, so thatthe purpose of miniaturization can be achieved. Furthermore, the thirddriving coil 2141 acts with the magnetic element MG to generate anelectromagnetic driving force to drive the frame 204 and the holder 108to move along the X-axis or the Y-axis with respect to the base 112,thereby further enhancing the effect of optical image stabilization.

It should be noted that, in this embodiment, the first driving assembly30 is disposed between the third driving coil 2141 and the first movableassembly 20 for the purpose of miniaturization. In addition, similar tothe first driving assembly 30 and the second driving assembly 50, thethird driving assembly 60 can also be electrically connected to thecircuit member 114, so as to be electrically connected to the base plate120 and the control circuit CT thereon. Therefore, the control circuitCT can control the first driving assembly 30, the second drivingassembly 50, and the third driving assembly 60.

The present disclosure provides a photosensitive element drivingmechanism which has a first driving assembly 30 and a first movableassembly 20. The first movable assembly 20 is held by the first drivingassembly 30 and is suspended in the outer frame 102 of the fixedassembly 10. The photosensitive element 122 is disposed on the circuitmember 114 of the first movable assembly 20, and the first drivingassembly 30 is configured to drive the circuit member 114 and thephotosensitive element 122 to move relative to the fixed assembly 10, soas to achieve the purpose of optical image stabilization.

Furthermore, in some embodiments, the photosensitive element drivingmechanism may further include a third driving assembly 60 configured todrive the holder 108 of the second movable assembly 40 and the opticalcomponent LS to move along the XY plane relative to the fixed assembly10, so as to further enhance the effect of optical image stabilization.

Although the embodiments and their advantages have been described indetail, it should be understood that various changes, substitutions, andalterations can be made herein without departing from the spirit andscope of the embodiments as defined by the appended claims. Moreover,the scope of the present application is not intended to be limited tothe particular embodiments of the process, machine, manufacture,composition of matter, means, methods, and steps described in thespecification. As one of ordinary skill in the art will readilyappreciate from the disclosure, processes, machines, manufacture,compositions of matter, means, methods, or steps, presently existing orlater to be developed, that perform substantially the same function orachieve substantially the same result as the corresponding embodimentsdescribed herein can be utilized according to the disclosure.Accordingly, the appended claims are intended to include within theirscope such processes, machines, manufacture, compositions of matter,means, methods, or steps. In addition, each claim constitutes a separateembodiment, and the combination of various claims and embodiments arewithin the scope of the disclosure.

What is claimed is:
 1. A photosensitive element driving mechanism,comprising: a fixed assembly, having a base plate; a first movableassembly, including: a circuit member, movable relative to the fixedassembly, and the circuit member including: a circuit member body; and amovable cantilever; a photosensitive element, configured to receivelight traveling along an optical axis, wherein the photosensitiveelement is disposed on the circuit member body and is electricallyconnected to the circuit member; and a first driving assembly,configured to drive the first movable assembly to move relative to thefixed assembly; wherein there is a gap formed between the first movableassembly and the fixed assembly, and the photosensitive element isdisposed on the circuit member body; wherein the movable cantilever hasa first segment extending in a direction different from the opticalaxis; wherein the first movable assembly further includes a first frameconfigured to accommodate the photosensitive element, and the firstframe has a recessed portion corresponding to the first segment, so thatwhen the circuit member body and the first frame move, the movablecantilever does not collide with the first frame; and wherein thephotosensitive element is disposed between the circuit member and thefirst driving assembly.
 2. The photosensitive element driving mechanismas claimed in claim 1, wherein the first segment is electricallyconnected to the photosensitive element and the fixed assembly, and thefirst movable assembly moves relative to the fixed assembly through themovable cantilever.
 3. The photosensitive element driving mechanism asclaimed in claim 2, wherein the first segment has a first circuit layerand a second circuit layer, and the first circuit layer and the secondcircuit layer are distributed on different planes.
 4. The photosensitiveelement driving mechanism as claimed in claim 2, wherein a size of thefirst segment in a direction of the optical axis is greater than a sizeof the first segment in a direction perpendicular to the optical axis.5. The photosensitive element driving mechanism as claimed in claim 1,wherein the movable cantilever further has a second segment, and thesecond segment and the first segment extend in different directions. 6.The photosensitive element driving mechanism as claimed in claim 5,wherein when the first driving assembly drives the circuit member bodyto move in a first moving direction, an amount of deformation of thefirst segment is greater than an amount of deformation of the secondsegment.
 7. The photosensitive element driving mechanism as claimed inclaim 6, wherein when the first driving assembly drives the circuitmember body to move in a second moving direction, the amount ofdeformation of the first segment is smaller than the amount ofdeformation of the second segment, and the first moving direction is notparallel to the second moving direction.
 8. The photosensitive elementdriving mechanism as claimed in claim 1, wherein the circuit member bodyis made of a rigid material, and the movable cantilever is made of aflexible material.
 9. The photosensitive element driving mechanism asclaimed in claim 1, wherein the circuit member body and the movablecantilever are integrally formed in one piece and are made of a flexiblematerial, and the photosensitive element driving mechanism furtherincludes a plate body connected to a bottom of the circuit member body.10. The photosensitive element driving mechanism as claimed in claim 9,wherein the plate body is a metal plate, configured to promote the heatdissipation of the circuit member by heat conduction.
 11. Thephotosensitive element driving mechanism as claimed in claim 1, whereinthe photosensitive element driving mechanism further comprises: a secondmovable assembly, configured to hold an optical component, wherein thesecond movable assembly is movable relative to the fixed assembly; and asecond driving assembly, configured to drive the second movable assemblyto move in a first direction relative to the fixed assembly, whereinboth the first driving assembly and the second driving assembly areelectrically connected to the circuit member.
 12. The photosensitiveelement driving mechanism as claimed in claim 11, wherein the fixedassembly further includes an outer frame configured to accommodate thefirst movable assembly, the second movable assembly and thephotosensitive element, and the photosensitive element driving mechanismfurther comprises a control circuit disposed outside the outer frame anddisposed on the base plate.
 13. The photosensitive element drivingmechanism as claimed in claim 12, wherein the outer frame is disposed onthe base plate.
 14. The photosensitive element driving mechanism asclaimed in claim 11, wherein the photosensitive element drivingmechanism further comprises a third driving assembly configured to drivethe second movable assembly to move in a second direction relative tothe fixed assembly, the second direction is not parallel to the firstdirection, and the third driving assembly is electrically connected tothe circuit member.
 15. The photosensitive element driving mechanism asclaimed in claim 11, wherein the second driving assembly includes aplurality of second driving magnetic components, and when viewed in adirection of the optical axis, the second driving magnetic componentsare arranged in a rotationally symmetrical form with respect to theoptical axis.
 16. The photosensitive element driving mechanism asclaimed in claim 1, wherein the photosensitive element driving mechanismfurther includes a position sensing assembly configured to sense motionof the first movable assembly relative to the fixed assembly.
 17. Thephotosensitive element driving mechanism as claimed in claim 1, whereinthe first driving assembly includes a spring sheet, an insulating layeris formed on the spring sheet, and the first driving assembly furtherincludes at least one electronic line formed on the insulating layer.